As electronic devices continue to develop towards miniaturization, high performance and multifunctionality, embedded passive component integration technology in PCBs has attracted more and more attention.
At present, embedded passive component integration technology has made certain progress. In terms of materials, a variety of passive component materials suitable for embedding have been developed, such as ceramic materials with high dielectric constants for making capacitors, and thin film materials with specific resistance characteristics for resistors. In terms of technology, some advanced manufacturing methods such as laser drilling, photolithography combined with electroplating, etc., can accurately embed passive components into the specified position inside the PCB, achieving a certain degree of high-density integration. For example, in the motherboard design of some high-end smartphones, attempts have been made to use embedded capacitor technology to reduce the overall area of the circuit board, increase signal transmission speed, and improve power integrity.
However, the technology also faces many challenges in its development. First, the high cost is the key factor restricting its large-scale application. The material cost of embedded passive components is relatively high, and its special manufacturing process requires more sophisticated equipment and more complex production processes, which undoubtedly increases the production cost. Second, the technical difficulty is relatively high. It is not easy to ensure good electrical connection and mechanical stability between the embedded passive components and the PCB. Defects such as interlayer separation and poor electrical connection are prone to occur during the manufacturing process, and the control requirements for the production process are extremely strict.
In addition, the complexity of the design is also a major challenge. When the passive components are embedded in the circuit board, the design rules of the entire circuit board have changed, and new design concepts and tools are needed to support it. Designers must not only consider the characteristics of the passive components themselves, but also take into account their coordination with other active components and the entire circuit system, which places high demands on the professional quality and design experience of designers.
Although the embedded passive component integration technology in PCB has potential, to overcome the challenges of cost, technical difficulty and design complexity, all parties in the industry still need to continue to invest in research and development, and continue to explore innovation to promote the technology to a more mature and widespread application stage.
